2-DAY
IC AND COMPONENT RELIABILITY SHORT COURSE
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VERY Quick Start Version Sample Slides
Quick Start Version Sample Slides
You can also listen to a sample module on Realizing Reliability in both versions:
First, for the basic VERY Quick Start (VQS) Version click here
After listening to the VQS version,
for the supplemental Quick Start Version click here
INTEGRATED CIRCUIT RELIABILITY COURSE
Two Versions: VERY Quick Start and Quick Start
Available as Narrated E Learning, Webinar or In-House Formats
Dr. Ted Dellin
Reliability is a critical concern for the manufacturers and users of products, including integrated circuits (ICs). This course is designed to quickly and easily provide relevant information that will enable allow students to more successfully meet current and future reliability challenges. No prior reliability knowledge is assumed. The course focuses on four areas: describing reliability, reliability engineering, reliability physics and reliability management. The reliability description, management and engineering sections are quite general, and apply to a wide range of products, not just ICs.
An outline of the course modules is given below. The Very Quick Start Version provides a one-day overview (7 ¼ hour Narrated Course). The 10 1/2 hour Quick Start Version is not a stand alone course, but is a supplement to the Very Quick Start Version and provides additional material for persons who want more depth and breadth.
The course starts with describing reliability (definitions, reliability functions and bathtub curve). Next, the reliability management sections focus on reliability program goals and how to meet them (building-in reliability, designing-in reliability, testing-in reliability, wafer level reliability). The reliability engineering explains the distributions of times to failures, sampling/confidence limits and accelerated testing . The reliability physics section focuses on the major CMOS IC failure modes (breakdown, hot carrier, NBTI, electromigration, voiding, SEU, packaging failure mechanisms) .
This course as part of an integrated curriculum in microelectronics, optoelectronics, MEMS/Microsystems and reliability developed and are taught by Dr. Ted Dellin. Dr. Dellin retired as Chief Scientist of the Microsystems Center at Sandia National Labs and led the development of the reliability section of the International Technology Roadmap for Semiconductors.
Module Topics
Very Quick Start Quick Start
1. Introduction 31 min. 9 min.
2. Describing Reliability I: Definitions 24 min. - - -
3. Describing Reliability II: Units 18 min. 43 min.
4. Describing Reliability III: Bathtub Curve 15 min. 25 min.
5. System Reliability 14 min. - - -
6. Goals of a Reliability Program 15 min. 25 min.
7. Meeting the Reliability Challenge (Building-In Rel) 47 min. 48 min.
8. Developing a Reliability Program 16 min. 33 min.
9. Dealing With Variability 16 min. 36 min.
10. Reliability Plotting 16 min. 41 min.
11. Confidence Limits 33 min. 60 min.
12. Which is the Correct Distribution? - - - 38 min.
13. True Accelerated Aging 17 min. 21 min.
14. Accelerated Aging Models 15 min. 32 min.
15. Qualification 40 min. - - -
16. Brief review of transistors & ICs 34 min. - - -
17. Time Dependent Dielectric Breakdown 13 min. 57 min.
18. Hot Carrier & NBTI Degradation 12 min. 42 min.
19. Interconnect Failure Mechanisms 28 min. 53 min.
20. Other Failure Mechanisms (ESD, SEU, …) 11 min. 27 min.
21. Package failure mechanisms 18 min. 35 min.
22. Packaged IC Reliability Tests (Burn In) 12. min. 11 min.